Electronics Packaging school training courses in Albuquerque, NM (public, in-house or online)

Mechanical Behavior of Solids

This section covers the mechanical behavior of polymers. This includes properties like glass transition temperature, the coefficient of thermal expansion, fracture toughness, elastic modulus, viscoelastic behavior, adhesion, peel strength, and water absorption.
Polymer Case Studies

This section covers three case studies involving problems with polymers in electronics applications. They include a coefficient of thermal expansion problem with a connec...

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This material covers issues related to System on a Chip (SoC) and System in a Package (SiP). Both technologies have their advantages and disadvantages.

System-on-a-Chip vs. System-in-a-Package

This section describes System-on-a-Chip (SOC) and System-in-a-Package (SIP) integration approaches. It highlights the advantages and disadvantages of each one.

Semiconductor packaging is becoming increasingly challenging. As integrated circuits increase in performance, new packaging techniques are required to remove the heat, handle the increased number of bondpads, and deal with the fragile Lo-K dielectrics used on these circuits. New technologies such as optoelectronics and microelectromechanical systems (MEMS) can require specialized packages. Smaller form factors require engineers to use higher density packaging options, like array packaging, chip ...

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This material covers the electrical behavior, thermal properties, and the structural and mechanical aspects of electronic packaging. As packaging technology increases in complexity, a whole host of electrical, thermal, and mechanical issues must be accounted for and modeled. The electrical issues include resistance, capacitance, cross talk issues, power and ground bus disturbances, and high frequency packaging. Thermal issues include heat dissipation, the uses of ceramic and plastic, actively co...

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This section covers reliability failure mechanisms in semiconductor components that are related to the package, or package and assembly process. It can be grouped into several categories: moisture and contamination, thermal degradation, and thermomechanical stress.

Moisture and Corrosion

Moisture represents a significant threat to semiconductor reliability. A number of materials used in the semiconductor manufacturing and packaging processes can react with moisture (or moisture and...

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